Ceramic Forum, Glass Manufacturing Technology and Wide-Gap Semiconductors

Offering SiC bulk wafer and SiC Epi Services, SiC device manufacturing services, CMP services, and Ion implantation services.

Offering top quality Ammono GaN bulk wafer + GaN epitaxy.

Apart from having started sales of our CF-developed crystal evaluation device, we deal in DLTS measuring devices, Raman microscopes, wafer flatness measuring devices and PL Wafer Scanners.

Offering DLTS Measuring services for highly sensitive detection of impurities and defects in semiconductors, as well as crystal evaluation services.Especially good results in wide-gap semiconductors (SiC, GaN, AIN etc.)

Fundamental research primarily by Czech Glass Services, Inc.; Bubble/Stone analysis technology, Dissolved gas analysis, Redox Measuring Device (Rapidox), High Temperature Observation (HTO), High temperature glass material properties measurements etc. ...

Operational conditions for glass melting furnaces are calculated by fundamental research and computer simulation technology. ​However, a variety of engineering technology is necessary to realize operational conditions.