Yuhi Edge Grinder / Profiler
YH-8800 Edge Grinder: Fully automatic cassette-to-cassette grinder for 6 to 8 inch wafers. Equipped with high precision centering (±30µm), it performs highly efficient wafer edge grinding. It has a high market share especially for compound semiconductor processing such as SiC.
Key features
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High precision centring
achieves ±30µm accuracy.
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High throughput
Dual axis control enables efficient grinding.
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Excellent crystal orientation
Precise centring maintains optimum crystal structure.
Features
Non-contact measurement
Supports wafers from 2" to 12".
High-precision measurement
Equipped with a 1.3MP single lens CCD camera for detailed profile data.
Manufacturer Introduction
Yuhi Co.,Ltd.
The company develops and manufactures edge grinders and edge profilers for compound semiconductor wafers such as SiC and GaN. The company has a 40-year history in the development of wafer edge grinders and has been involved in the joint development of equipment with its predecessor, Yuhi Electronics, from the early stages.
In particular, the company has a long track record in SiC equipment, having delivered its first SiC equipment in 2008, and has supplied equipment to many SiC wafer manufacturers in Europe and the United States, as well as major wafer manufacturers in Japan. They have a competitive edge profiler with a processing accuracy advantage over our competitors and we have supplied more than 60 edge profilers in total.
