Shuwa Grinding / Polishing Equipment
Shuwa Industry Co., Ltd. specializes in the design, manufacture and sale of precision grinding, lapping and polishing equipment.
The company excels in the high-precision processing of compound semiconductor wafers and brittle materials.
SGM-9100: A fully automated high-precision cassette-to-cassette grinder.Optimized for difficult-to-machine and brittle materials such as compound semiconductor wafers.
Features a 2-axis, 3-chuck rotary table system and IPG control for simultaneous thickness measurement and machining.
Equipped with a high rigidity frame and high power 11kW motor for efficient grinding of 8" SiC wafers.
SGM-8000: SGM-8000 is a semi-automatic vertical spindle grinder that supports table sizes from 200 to 300mm.
Offers high flexibility and precision for compound semiconductor and SiC wafer processing.
Technical features
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High precision
Shuwa machines deliver high accuracy and uniformity, contributing to improved quality of LED wafers and semiconductor substrates.
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High Power
Equipped with an 11kW motor, enabling efficient processing of hard materials like SiC.
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IPG Control
Enables real-time thickness measurement during grinding.
Corporate Introduction
Shuwa Industry Co.,Ltd
Founded in 1971, Shuwa Industry Co., Ltd. is a specialized manufacturer of wafer polishing and grinding equipment for the semiconductor industry. The company is particularly renowned for its expertise in processing compound semiconductors such as SiC and GaN, and was the first in Japan to release a polishing system specifically designed for SiC wafers.
Driven by the philosophy of achieving “thinner, flatter, and more mirror-like surfaces,” Shuwa continues to lead in high-precision surface processing technology. With a strong commitment to innovation and customer satisfaction, the company has earned a solid reputation for reliability and performance both in Japan and around the world.
