Sciensee SiC & GaN Wafer Measurement / Inspection Equipment

A high-precision system compatible with transparent and opaque materials including silicon, glass, sapphire, GaN, and SiC. It measures TTV, BOW, THK, WARP, and LTV, supporting processes such as cutting, grinding, polishing, and thinning. Customizable for full or semi-automated operation , the upgraded "SurfPro PLUS" enhances inspection speed while maintaining ease of use.

Specialized systems for inspecting SiC substrates and epitaxial wafers.

Utilizing precision optical imaging and proprietary algorithms, they automatically detect and classify crystal/epitaxial defects (micropipes, stacking faults, BPDs) as well as surface particles, scratches, pits/protrusions, cracks, voids, and polytype defects. Options range from semi-automatic benchtop units to fully automated systems with robotic arms, featuring enhanced line-scanning modules for significantly improved efficiency.

We offer diverse equipment to manage and track the entire production chain.

This includes the "Film Thickness and Nano/Microstructure Measurement Instrument" for measuring total thickness, layer thickness in multi-material stacks, and roughness. The "Wafer Chamfer Profile Inspection Equipment" measures diameter, bevel angle, notch dimensions, and edge chipping, supporting data management and MES integration. The lineup also features an "Automatic Stress Detector" with a patented adjustable wafer holder (150-220mm) , and a "Batch Wafer ID Reader (OCR)" for continuous wafer tracking.