Inspection/Manufacturing Equipment

The Crystalline Tester CS2 is a state-of-the-art system designed for the non-destructive evaluation of the crystal quality of semiconductor wafers. It provides fast and accurate inspections, making it ideal for both production line quality control, and also R&D.

The Crystalline Tester CP1 is a high performance system for non-destructive detection of internal crystal defects in semiconductor wafers. With advanced 3D inspection and automated defect detection capabilities, it is perfectly suited for R&D and production line quality control.

The Phystech FT1230 DLTS system offers high sensitivity for defect analysis in semiconductor materials. It combines superior DLTS measurement functionality with sophisticated software adaptable to a wide range of materials.

Ceramic Forum offers in-situ monitoring and mapper systems developed by LayTec AG (Germany), and designed for deposition equipment.

The LayTec EpiX Wafer Mapper is a high-precision system that uses optical reflectance and photoluminescence to map wafers. It enhances quality control in semiconductor manufacturing and improves overall productivity.

AEHR is a world leader in burn-in and test systems for both packaged parts and wafer level devices. Their unique full-wafer test and burn-in solutions and also contactor provide scalable parallel test capabilities for the semiconductor industry.

Shuwa Industry Co., Ltd. specializes in the design, manufacture, and sale of precision grinding, lapping, and polishing equipment. Their systems are particularly renowned for high-precision handling of compound semiconductor wafers and brittle materials with high accuracy.

Epiquest Co., Ltd. is a specialist in epitaxial technology, known for providing high performance KOH etching systems for SiC wafers. They also have extensive experience in the design and manufacture of MBE and MOCVD systems.

Yuhi Corporation offers edge grinding and profiling measurement systems for semiconductor wafers.
In particular, it offers high precision and efficiency in processing compound semiconductor wafers such as SiC and GaN. Edge Grinder YH-8800 : Their YH-8800 edge grinder is a fully automatic cassette-to-cassette grinding machine for 6 to 8 inch wafers. It includes a precise centering function(±30µm) and efficiently grinds the outer periphery of the wafer. It has a leading market share in compound semiconductor processing.

Instec Inc. is a leader in thermal analysis and temperature control solutions, providing high-precision temperature control equipment for scientific research and industrial applications. Dedicated to precision, innovation and quality, they offer a wide range of products to meet customer needs.

NIDEC Corporation offers precision interferometer technology for wafer flatness measurement. The FT-900 series supports a wide range of materials, including silicon, SiC, GaN and sapphire, providing ultra-precise flatness evaluation.